EE Times Europe spoke with Elektrobit’s Moritz Neukirchner to understand the penetration of Linux in automotive. The automotive industry continues its transition to software-defined vehicles (SDVs) ...

The March 2025 edition of EE Times Europe Magazine explores the potential of edge AI technologies in enhancing real-time decision-making across various sectors. It also reviews recent advancements in ...

Amid rising tensions with Russia, Saab and the Swedish Armed Forces have demonstrated a swarm of 10 drones, with NATO Arctic Strike exercises to follow. Amid rising tensions with Russia, Saab and the ...

Most new cars are equipped with adaptive cruise control (ACC). However, ACC has several limitations that can pose safety risks. In this article, Onn Haran, founder and CTO of Autotalks, explains how ...

As global tensions rise, European companies are uniting to develop edge AI for swarms of autonomous drones in Ukraine and beyond. Late last year, Ukraine-based Swarmer secured $2.7 million to develop ...

Despite AI’s rapid progress, memory remains its Achilles’ heel. As AI continues its rapid evolution, the demand for higher performance, lower power consumption, and efficient memory solutions spans ...

What happens when older, obsolete systems are still mission-critical? That’s where legacy equipment manufacturing comes in. What determines value? In fast-moving industries like electronics, value is ...

“Nervous anticipation” has described the mood going into 2025. 2024 proved to be a much tougher year for our industry than nearly anyone had predicted. At the start of last year, most were foreseeing ...

With the growth in popularity of the Open RAN approach, Peter Claydon, CEO of RANsemi, commented on how the company has embraced change. A recent Dell’Oro Group report titled ‘What to expect from RAN ...

MWC 2025 Barcelona discussed the opportunities of a connected future that is expected to add nearly $11 trillion in economic value by 2030. The 2025 edition of MWC Barcelona, from March 3 to 6, ...

A new generation of software tools aims to provide chip designers with even more comprehensive and accurate assessments of the environmental impact of their designs. As the microelectronics industry ...

Building on the innovation of ultra-compact 7.2mm x 7.2mm eMMC, Longsys (SZ.301308) now presents its latest advancement ideal for wearable storage use cases—the ultra-thin 0.6mm (max) ePOP4x, which ...